# Team Lead Co-Packaged Optics (m/f/d) at Q Ant Gmbh

- Company: Q Ant Gmbh (qant.com)
- Location: Stuttgart, Munich, Austin
- Places: Stuttgart, United States
- Posted: 2026-06-29
- Apply: https://q-ant-gmbh.jobs.personio.de/job/2690309
- Page: https://ye.saranatour.dev/jobs/team-lead-co-packaged-optics-m-f-d-q-ant-gmbh-kn78q7tdsgv905qn7c636m0w0s8hems5

## The posting

Team Lead Co-Packaged Optics (m/f/d)
Q Ant Gmbh · Stuttgart, Munich, Austin

The future of AI computing is light, not electrons.

Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As our **Team Lead Co-Packaged Optics**, you are the architectural and leadership anchor of our next-generation semiconductor packaging. You will build, coach, and scale a brand-new CPO Packaging Team from the ground up, driving the transition from concept phase to high-volume production. This role is about establishing absolute technical ownership at the intersection of photonics and electronics, bridging the gap between internal cutting-edge chip design and external global OSAT manufacturing.

**Your Responsibilities**

- **Leadership****& Team****Architecture****:** Build, mentor, and disciplinarily lead a high-performing CPO Packaging engineering team; execute gap analyses and strategic hiring to accelerate our scaling roadmap.
- **OSAT & Supply Chain Mastery:** Own the evaluation, qualification, and end-to-end technical management of global OSAT partners, ensuring the secure onboarding of at least two qualified CPO suppliers within 12 months.
- **Technical Ownership (CPO & Fiber Attach):** Drive the development of advanced co-packaged photonic/electronic assemblies, mastering deep hardware challenges across optical fiber coupling (Edge Coupling, FAUs), advanced packaging materials, and high-performance thermal management.
- **Design for Excellence (DFM):** Bridge the gap between engineering and mass manufacturing by implementing strict Design for Manufacturability (DFM) guidelines and ensuring reliability qualification under JEDEC and Telcordia standards.
- **Cross-Functional Synergy:** Act as the critical interface between internal Chip Design, Systems, Manufacturing, Test, and external supply chain stakeholders to ensure a seamless product introduction (NPI) and volume production roll-out.
- **Continuous Engineering Quality:** Champion rigorous root-cause analysis utilizing structured frameworks (8D, FMEA, Ishikawa) to rapidly resolve unexpected reliability or process deviations.

- **Academic Foundation:** You hold a Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a closely related technical field.
- **Semiconductor & OSAT Expertise:**You possess at least 5 years of profound experience within the Semiconductor Packaging industry (Back-End / OSAT environment), with a proven track record in global supplier evaluation.
- **CPO & Precision Hands-on Skills:**You have direct, hands-on experience with Co-Packaged Optics (CPO) packaging, optical fiber attachment methods, and navigating advanced packaging materials (substrates, underfills, TIMs).
- **Leadership & Empowerment:**You have demonstrated experience in building, scaling, and coaching engineering teams, fostering a culture of high performance and technical accountability.
- **Analytical Self-Leadership:** You thrive in high-growth, innovative environments, demonstrating an advanced solution-oriented mindset and strong process ownership under tight project milestones.
- **Communication Excellence:**You possess exceptional written and verbal communication skills; fluency in English is required. Prior experience with glass substrates and proficiency in German are considered a distinct advantage for collaborating wi