ASM · posted 7h ago
Develop and optimize advanced ALD processes for next-generation semiconductor applications, moving them into high-volume manufacturing.
**Step into a career with ASM, where cutting edge technology meets collaborative culture.**
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
Job mission
As a key member of our Advanced Packaging R&D team, you will lead the development and optimization of advanced Atomic Layer Deposition (ALD) processes for next-generation semiconductor applications. Combining deep technical expertise with hands-on experimentation, you will translate complex process challenges into innovative, manufacturable solutions and work closely with cross-functional and customer teams to successfully demonstrate and transfer technologies into high-volume manufacturing.
What you will be working on
We could be a great match for each other if you have:
Apply today to be part of what’s next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on [LinkedIn](https://www.linkedin.com/company/as