Axon · posted 5w ago
Own the electrical design of complex, highly integrated hardware, from schematic capture and PCB layout through bring-up and mass production.
At Axon, we’re on a mission to Protect Life. We’re explorers, pursuing society’s most critical safety and justice issues with our ecosystem of devices and cloud software. Like our products, we work better together. We connect with candor and care, seeking out diverse perspectives from our customers, communities and each other.
Life at Axon is fast-paced, challenging and meaningful. Here, you’ll take ownership and drive real change. Constantly grow as you work hard for a mission that matters at a company where you matter.
Axon 911 brings together Prepared and Carbyne under Axon. Together, we are creating the only platform that combines modern 911 infrastructure with an AI intelligence layer—helping public safety agencies move faster, make better decisions, and deliver better outcomes in the moments that matter most.
911 is the backbone of public safety, yet the professionals behind it have long been held back by outdated technology. Axon 911 is here to change that. Joining this team means more than taking a job—it means helping shape the future of emergency response and building a safer, more connected world.
We are seeking a Senior Electrical Engineerspecializing in schematic and circuit board design to own the electrical design, development, and validation of complex, highly integrated hardware for mission-critical connected devices.
As a founding member of our hardware team, you will have significant ownership across the full hardware lifecycle—from system architecture and component selection through schematic capture, PCB layout, bring-up, validation, certification, and mass production.
You will design high-density, mixed-signal electronics integrating application processors, memory, power management, battery systems, wireless devices, and high-speed interfaces. You’ll work closely with RF, Mechanical, Firmware, and Manufacturing teams to solve complex challenges across signal integrity, power integrity, board architecture, thermal constraints, EMI/EMC, and form factor.