# Principal Process Engineer - DRAM and Memory Applications at ASM

> Develop and optimize advanced thin-film deposition processes for next-generation DRAM and memory technologies.

- Company: ASM (asm.com)
- Location: US > Arizona > Phoenix
- Places: US > Arizona > Phoenix
- Posted: 2026-10-27
- Level: Principal
- Team: Process Engineering - DRAM and Memory Applications
- Apply: https://www.asm.com/open-vacancies/?gh_jid=5016921101
- Page: https://ye.saranatour.dev/jobs/principal-process-engineer-dram-and-memory-applications-asm-kn7fq2pkjtfr37grx75xpd2a8x8hgv6v

## The posting

Principal Process Engineer - DRAM and Memory Applications
ASM · US > Arizona > Phoenix

**Step into a career with ASM, where cutting edge technology meets collaborative culture.**​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

As a **Principal Process Engineer** at ASM, you will leverage semiconductor processing and analytical equipment to research, develop, and optimize advanced thin-film processes enabling next-generation **DRAM and memory technologies**. Your work will focus on Atomic Layer Deposition (ALD, PEALD), Epitaxy, PECVD, oxidation, annealing, and curing processes used in highly scaled memory structures, including capacitors, word lines, bit lines, storage nodes, and advanced memory integration schemes.

You will apply deep technical expertise in memory device fabrication to deliver innovative process solutions that address critical scaling, performance, reliability, and integration challenges. You will design and execute complex experiments, interpret advanced characterization data, and collaborate closely with customers and product teams to accelerate technology development. Technical publications, customer engagement, and the creation of Intellectual Property (IP) are key aspects of this role.

**Key Responsibilities**

- Develop and optimize advanced deposition processes for DRAM and emerging memory applications utilizing ALD, PEALD, Epitaxy, and PECVD technologies.

- Drive process innovation for memory-critical films, including high-k dielectrics, capacitor materials, metal electrodes, barrier layers, conductors, and emerging memory materials.

- Support technology development focused on DRAM scaling challenges such as capacitor formation, buried word lines, advanced patterning, and high-aspect-ratio structures.

- Remain at the forefront of memory technology trends and roadmaps to identify new process opportunities and technology requirements.

- Serve as a technical consultant and subject matter expert for internal teams and leading memory manufacturers worldwide.

- Lead technical problem-solving efforts using scientific methodologies, statistical analysis, and industry-standard tools.

- Design and execute experiments utilizing Design of Experiments (DOE) and Response Surface Methodology (RSM) to optimize process performance.

- Analyze electrical, physical, and materials characterization data to understand film properties and device performance.

- Troubleshoot equipment and process issues through hands-on experimentation and root cause analysis.

- Collaborate with customers to define requirements, execute demonstrations, and develop process solutions addressing critical memory integration challenges.

- Develop methods and techniques for integrating advanced materials into future DRAM and memory device architectures.

- Support product transfers, customer demonstrations, field training, and process documentation to ensure successful deployment of new technology.

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